ITI - USA

Dicing/Singulation Blades

Dicing Blades/Singulation Blades and Wheels

ITI's precision Dicing Blades/Singulation Blades are manufactured for mounting to hubs and arbors on special saw machines for precision singulating, slicing, dicing and slotting semiconductor components, hard disk drive heads, precision glass components, etc

These Dicing Blades/Singulation Blades can be as thin as 0.003” (75 microns), and the Dicing Blades/Singulation Blades range in size from 0.5” to 8” O.D. (12mm to 200mm)

These Dicing Blades/Singulation Blades can be as thin as 0.003” (75 microns), and the Dicing Blades/Singulation Blades range in size from 0.5” to 8” O.D. (12mm to 200mm)

Dicing Blades/Singulation Blades - Metal & Resin Bond

ITI Dicing Blades/Singulation Blades Collage

Extensive experience manufacturing Dicing Blades/Singulation Blades for a broad range of precision applications

  • BGA, QFN, CSP, and other chip carrier packages
  • High Powered LED
  • Glass for optics and photonics
  • Discrete electronic components, such as MLCC (Multi-layer ceramic capacitors)
  • Thin-film disk drive heads
  • Ceramic
  • Steels, Ferrite, and PZT
ITI Dicing Blades/Singulation Blades Collage
ITI Dicing Blades/Singulation Blades Package

ITI Capabilities

  • In-house test cutting and process development lab
  • Effective technical customer support
  • Custom engineered innovative designs for Dicing Blades/Singulation Bladess
  • Over 30 years experience producing Dicing Blades/Singulation Blades in-house
  • Millions of high precision Dicing Blades/Singulation Blades produced

Features

  • Standard and custom formulations for Dicing Blades/Singulation Blades
  • Resin and metal bonded (sintered) Dicing Blades/Singulation Blades
  • Hybrid dicing blade life increases up to 400% over standard metal bond Dicing Blades/Singulation Blades
  • Longer life and low cost increases customer UPH and improves overall cost per cut
  • Diamond or CBN abrasive
  • Precision tolerances available

Available dicing blade sizes range from .5 inches to 8 inches OD (12mm to 200mm). Bonded Dicing Blades/Singulation Blades as thin as 0.003 inches (75 microns)

Available tolerances as tight as 1 micron on thickness, 2 microns on parallelism

Engineered Solutions

ITI has standard Dicing Blades/Singulation Blades available for many applications and all brands of sawing and dicing machines. In addition, ITI can custom formulate Dicing Blades/Singulation Blades for your specific application to maximize throughput and cut quality. Dicing blade life can be enhanced by as much as four times that of other leading dicing blade manufacturers

ITI Dicing Blades/Singulation Blades are fabricated with the highest quality diamond, CBN and bond constituents available. Critical properties such as friability, size, shape, concentration, and bond strength are all carefully considered during the design to ensure optimized performance